What's New

05/09/2023   One authored and one coauthored papers are presented in The 84th JSAP Autumn Meeting 2023 (Sept. 19-23, 2023, Kumamoto and Online) [in Japanese].
05/09/2023   Two papers are presented by Dr. Jianbo Liang in 33rd International Conference on Diamond and Carbon Materials (Sept. 10-14, 2023, Mallorca, Spain).
01/09/2023   Prof. Shigekawa provided an invited talk entitled "Direct bonding of diamond for fabricating low-thermal-resistance semiconductor devices" in 25th Seminar of the Subcommittee of Advanced Power Semiconductors, the Japan Society of Applied Physics (Sept. 1, 2023, Tokyo) [in Japanese].
01/04/2023   Member list updated.
13/03/2023   Dr. Jianbo Liang gives an invited talk entitled "High performance GaN-on-diamond devices fabrication using diamond wafer bonding technology" in Hasselt Diamond Workshop 2023 - SBDD XXVII (March 15-17, 2023, Hasselt, Belgium).
13/03/2023   Two authored and one coauthored papers are presented in The 70th JSAP Spring Meeting 2023 (March 15-18, 2023, Tokyo and Online) [in Japanese].
27/02/2023   One contributed and one invited presentations will be made in Nitride Session of ISPlasma2023 (March 5-9, 2023, Gifu, Japan).
23/11/2022   Co-authored paper entitled "High thermal conductivity in wafer-scale cubic silicon carbide crystals" is published on Nature Communications. A related press release is available [in Japanese].
13/11/2022   A paper is presented by Yuki Idutsu, a graduate student in our group, in 33rd International Photovoltaic Science and Engineering Conference (PVSEC-33) (Nov. 13-17, 2022, Nagoya, Japan).
16/10/2022   Prof. Shigekawa gives an invited talk entitled "X-on-Diamond Structures on Bonding-First Concept and Their Application to Advanced Devices" in 41st Electronic Materials Symposium (EMS-41) (Oct. 19-21, Kashihara, Japan) [in Japanese].
11/10/2022   Invited Review entitled "Heterojunctions fabricated by surface activated bonding—dependence of their nanostructural and electrical characteristics on thermal process" is online published on Japanese Journal of Applied Physics.
04/10/2022   Dr. Jianbo Liang presents his results entitled "Fabrication of High-Thermal-Stability GaN/Diamond Junctions via Intermediate Layers" in Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration (WaferBond '22) (Oct. 4-6, 2022, Schmalkalden, Germany).


Our research group was kicked out in Graduate School of Engineering of Osaka City University in Oct. 2011 for proposing and demonstrating concepts of novel semiconductor devices with higher efficiency and output power, lower loss, and more tolerance against harsh environment as essential parts for achieving "Sustainable Development Goals" (SDGs) and realizing greener society. We have been working on solar cells composed of mechanically-stacked subcells, or hybrid tandem solar cells, widegap semiconductor/narrow gap semicoductor heterojunctions, so-called "X-on-diamond" structures for lowering thermal resistance of devices, thick-metal-film based lower-loss interconnects and higher-Q passive components for monolithic integration, and solar cells with luminescent down-shifting materials. We are proceeding on research by developing and integrating all aspects of relevant technologies (semiconductor device fabrication, characterization,and so on) in combination with fundamental sciences such as physics and electronics. We have belonged to Graduate School of Engineering of Osaka Metropolitan University since April 2022.

We announce with sincere gratitude that we receive supports from a large number of institutes and companies. In particular we thank to JSPS-Kakenhi, Feasibility Study Program and "Development of high performance and reliable PV modules to reduce levelized cost of energy" Project of New Energy and Industrial Technology Development Organization (NEDO) as well as Adaptable and Seamless Technology Transfer Program through Target Driven R&D (A-STEP) and Core Research for Evolutional Science and Technology (CREST) Program of Japan Science and Technology Agency (JST) for their financial supports.

N. Shigekawa