What's New

21/01/2024   Our laboratory moved to Building B7 in Nakamozu campus of OMU. (Postal address: 1-1, Gakuen-cho, Naka-ku, Sakai, Osaka 599-8531, Japan)
21/01/2024   Prof. Shigekawa gave an invited talk in 15th Meeting of R032 Committee on Crystal Growth for Industrial Innovation, University-Industry Cooperative Committees of Japan Society for the Promotion of Science (Jan. 11-12, 2024, Hybrid, Japan) [in Japanese].
21/12/2023   Our achievements related to GaN-on-diamond HEMTs were press-released in Japanese and English formats, and featured in newspapers (The Nikkei and The Nikkan Kogyo Shimbun) [in Japanese].
18/12/2023   Prof. Shigekawa gave an invited talk in 14th Meeting of The Japan Society of Wide Gap Semiconductors (WideG) (Dec. 14-15, 2023, Okinawa, Japan) [in Japanese].
18/12/2023   Dr. Jianbo Liang gave an invited talk in The 9th International Forum on Wide Bandgap Semiconductors (Nov. 27-30, 2023, Xiamen, China).
05/10/2023   Prof. Shigekawa gives an invited talk in 2023 MRS Fall Meeting (Nov. 26-Dec. 1, 2023, Boston, USA). 
05/10/2023   One contributed paper entitled "Fabrication of nitride/3C-SiC/polycrystalline diamond heterostructures for efficient thermal management of power devices" is presented in ICNS 14 (Nov. 12-17, 2023, Fukuoka, Japan).
05/10/2023   Dr. Jianbo Liang gives an invited talk entitled "Integrating GaN with diamond for power devices with efficient thermal management" in International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) 2023 (Oct. 25-27, 2023, Taipei, Taiwan).
05/10/2023   One contributed paper entitled "Fabrication and Electrical Characterization of GaAs/GaN Junctions" is presented in 244th ECS Meeting (Oct. 8-12, 2023, Gothenburg, Sweden).
05/09/2023   One authored and one coauthored papers are presented in The 84th JSAP Autumn Meeting 2023 (Sept. 19-23, 2023, Kumamoto and Online) [in Japanese].
05/09/2023   Two papers are presented by Dr. Jianbo Liang in 33rd International Conference on Diamond and Carbon Materials (Sept. 10-14, 2023, Mallorca, Spain).
01/09/2023   Prof. Shigekawa provided an invited talk entitled "Direct bonding of diamond for fabricating low-thermal-resistance semiconductor devices" in 25th Seminar of the Subcommittee of Advanced Power Semiconductors, the Japan Society of Applied Physics (Sept. 1, 2023, Tokyo) [in Japanese].
01/04/2023   Member list updated.


Our research group was kicked out in Graduate School of Engineering of Osaka City University in Oct. 2011 for proposing and demonstrating concepts of novel semiconductor devices with higher efficiency and output power, lower loss, and more tolerance against harsh environment as essential parts for achieving "Sustainable Development Goals" (SDGs) and realizing greener society. We have been working on solar cells composed of mechanically-stacked subcells, or hybrid tandem solar cells, widegap semiconductor/narrow gap semicoductor heterojunctions, so-called "X-on-diamond" structures for lowering thermal resistance of devices, thick-metal-film based lower-loss interconnects and higher-Q passive components for monolithic integration, and solar cells with luminescent down-shifting materials. We are proceeding on research by developing and integrating all aspects of relevant technologies (semiconductor device fabrication, characterization,and so on) in combination with fundamental sciences such as physics and electronics. We have belonged to Graduate School of Engineering of Osaka Metropolitan University since April 2022.

We announce with sincere gratitude that we receive supports from a large number of institutes and companies. In particular we thank to JSPS-Kakenhi, Feasibility Study Program and "Development of high performance and reliable PV modules to reduce levelized cost of energy" Project of New Energy and Industrial Technology Development Organization (NEDO) as well as Adaptable and Seamless Technology Transfer Program through Target Driven R&D (A-STEP) and Core Research for Evolutional Science and Technology (CREST) Program of Japan Science and Technology Agency (JST) for their financial supports.

N. Shigekawa