What's New
| 10/04/2026 | Two authored and two co-authored presentations are given in 2026 9th International Workshop on Low Temperature Bonding for 3D Integration: Satellite in Kanazawa (May 13-15, 2026, Kanazawa, Japan). | |
| 01/04/2026 | Member list updated. | |
| 13/02/2026 | Two authored and two co-authored presentations are given in The 73rd JSAP Spring Meeting 2026 (March 15-18, 2026, Tokyo, Japan) [in Japanese]. | |
| 09/02/2026 | Yosei Sunamoto, a graduate student in our group, gives an invited presentation in General Conference of The Institute of Electronics, Information and Communication Engineers (March 9-13, 2026, Fukuoka, Japan) [in Japanese]. | |
| 13/12/2025 | Yosei Sunamoto, a graduate student in our group, received the best student presentation award for his presentation in Conference of Technical Committee on Electron Devices (ED), IEICE (Nov. 20-21, 2025, Kagoshima, Japan) [in Japanese]. | |
| 04/12/2025 | One contributed presentation and one plenary talk were given in The Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration (WaferBond '25) (Dec. 3-4, 2025, Chemnitz, Germany). | |
| 13/11/2025 | Two students will present their results in Conference of Technical Committee on Electron Devices (ED), IEICE (Nov. 20-21, 2025, Kagoshima, Japan) [in Japanese]. | |
| 13/11/2025 | One invited talk related to wafer-bonding based GaN-on-diamond HEMTs will
be given in 14th IEEE CPMT Symposium Japan (ICSJ2025) (Nov. 12-14, 2025, Kyoto, Japan). |
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| 01/10/2025 | Member list updated. |
Message
Our research group was kicked out in Graduate School of Engineering of
Osaka City University in Oct. 2011 for proposing and demonstrating concepts
of novel semiconductor devices with higher efficiency and output power,
lower loss, and more tolerance against harsh environment as essential parts
for achieving "Sustainable Development Goals" (SDGs) and realizing
greener society. We have been working on solar cells composed of mechanically-stacked
subcells, or hybrid tandem solar cells, widegap semiconductor/narrow gap
semicoductor heterojunctions, so-called "X-on-diamond" structures
for lowering thermal resistance of devices, thick-metal-film based lower-loss
interconnects and higher-Q passive components for monolithic integration,
and solar cells with luminescent down-shifting materials. We are proceeding
on research by developing and integrating all aspects of relevant technologies
(semiconductor device fabrication, characterization,and so on) in combination
with fundamental sciences such as physics and electronics. We have belonged
to Graduate School of Engineering of Osaka Metropolitan University since
April 2022.
We announce with sincere gratitude that we receive supports from a large
number of institutes and companies. In particular we thank to JSPS-Kakenhi,
Feasibility Study Program and "Development of high performance and
reliable PV modules to reduce levelized cost of energy" Project of
New Energy and Industrial Technology Development Organization (NEDO) as
well as Adaptable and Seamless Technology Transfer Program through Target
Driven R&D (A-STEP) and Core Research for Evolutional Science and Technology
(CREST) Program of Japan Science and Technology Agency (JST) for their
financial supports.
N. Shigekawa